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Effects of package and process variation on 2.4 GHz analog integrated circuits

机译:封装和工艺变化对2.4 GHz模拟集成电路的影响

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摘要

The effects of package and process variations on the parameters of an integrated 2.4 GHz low noise amplifier and a voltage controlled oscillator are presented. The influence of the number of ground pins on the LNA behaviour was investigated. Package and process variations cause substantial changes to the VCO oscillation frequency that have to be anticipated by appropriate simulations and coarse tuning has to be provided.
机译:提出了封装和工艺变化对集成的2.4 GHz低噪声放大器和压控振荡器的参数的影响。研究了接地引脚数量对LNA行为的影响。封装和工艺的变化会导致VCO振荡频率发生实质性变化,这必须通过适当的仿真来预测,并且必须提供粗调。

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