Electronic device encapsulation using red phosphorus flame retardants

摘要

This paper presents an analysis of the use of red phosphorus as a flame retardant material in encapsulated micro-circuits and discusses the reliability risks. Chemical reactions, which can arise when red phosphorus is exposed to ambient humidity to form highly mobile ions and oxygen-containing phosphorus acids, are presented. These ions and acids can induce electro-chemical migration, causing short circuits between leads and between wires, internal to the packaged device. Field failures caused by the red phosphorous flame retardant are also presented.