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High temperature electro-optical degradation of InGaN/GaN HBLEDs

机译:InGaN / GaN HBLED的高温电光降解

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摘要

This paper presents a study of the high temperature degradation of high brightness light emitting diodes (HBLEDs) on gallium nitride. Two different families of devices, from two leading manufacturers, have been submitted to thermal stress: during treatment, the optical and electrical characteristics of the devices have been analyzed. Degradation modes detected after stress have been (ⅰ) operating voltage increase, (ⅱ) output power decrease, (ⅲ) modifications of the spectral properties. The degradation of the electrical and optical characteristics of the devices were found to have different kinetics: this fact indicates that optical power (OP) loss is not strongly related to the degradation of the electrical parameters of the LEDs. On the other hand, spectral analysis indicated that OP loss is strongly related to the decrease of the phosphors-related yellow emission band. Microscopic analysis showed that this effect can be ascribed to the carbonization of the package and phosphorous material. A degradation of the transparency of the top-side ohmic contact has been also detected after stress: these mechanisms are thought to be responsible for the detected OP decrease. OP decay process has been found to be thermally activated, with activation energy equal to 1.5 eV.
机译:本文介绍了氮化镓上高亮度发光二极管(HBLED)高温降解的研究。来自两个领先制造商的两个不同系列的设备已受到热应力的影响:在治疗过程中,已对设备的光学和电气特性进行了分析。在应力作用下检测到的退化模式为(ⅰ)工作电压升高,(ⅱ)输出功率降低,(ⅲ)光谱特性发生变化。发现器件的电学和光学特性的下降具有不同的动力学特性:这一事实表明,光功率(OP)的损耗与LED的电参数的下降没有密切关系。另一方面,光谱分析表明OP损失与磷光体相关的黄色发射带的减少强烈相关。显微分析表明,这种影响可归因于包装和磷材料的碳化。应力后还检测到了顶侧欧姆接触的透明度下降:这些机制被认为是导致检测到的OP降低的原因。已经发现OP衰减过程是热激活的,激活能量等于1.5 eV。

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