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Optimization and performance of Al_2O_3/GaN metal-oxide-semiconductor structures

机译:Al_2O_3 / GaN金属氧化物半导体结构的优化与性能

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摘要

We investigate electrical properties of Ni/Al_2O_3/GaN metal-oxide-semiconductor (MOS) structures having different pre-treatment of GaN surface by O_2, Ar and NH_3, combined with various temperature of annealing. MOS and reference Ni/GaN Schottky contact are characterized using current-voltage and capacitance-voltage methods. MOS structures compared with the Schottky contact ones show leakage current reduction for all types of processing, from 3 to 5 orders of magnitude in reverse direct. We observed substantial influence of the pre-treatment on electrical parameters of MOS structures.
机译:我们研究了Ni / Al_2O_3 / GaN金属氧化物半导体(MOS)结构的电学特性,这些结构具有通过O_2,Ar和NH_3对GaN表面进行不同的预处理,并结合各种退火温度。使用电流-电压和电容-电压方法表征MOS和参考Ni / GaN肖特基接触。与肖特基接触结构相比,MOS结构在所有类型的处理中均显示出漏电流减小,反向方向从3到5个数量级。我们观察到了预处理对MOS结构电参数的重大影响。

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