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Carbon/polyesterimide thick-film resistive composites - Experimental characterization and theoretical analysis of physicochemical,electrical and stability properties

机译:碳/聚酯酰亚胺厚膜电阻复合材料-物理化学,电学和稳定性能的实验表征和理论分析

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摘要

This paper describes carbon/polyesterimide thick-film resistive composites. Polyesterimide (PEI) resin with high thermal durability served as an insulative matrix whereas medium structure carbon black (MSCB), blend of MSCB and graphite (G), and high structure carbon black (HSCB) have been used as an active phase. Chosen physicochemical investigations, electrical measurements (dependence of sheet resistance, hot temperature coefficient of resistance and 1/f noise on kind and content of conductive filler and curing temperature) and various stability tests have been used for complete description of MSCB/PEI, (MSCB + G)/PEI and HSCB/PEI thick-film resistor series. Electrical properties have been analyzed based on continuum percolation model completed by Balberg concepts connected with excluded volume and assumption of power distribution of distances between conductive grains embedded in polyesterimide.
机译:本文介绍了碳/聚酯酰亚胺厚膜电阻复合材料。具有高耐热性的聚酯酰亚胺(PEI)树脂用作绝缘基质,而中等结构的炭黑(MSCB),MSCB和石墨的共混物(G)和高结构的炭黑(HSCB)已用作活性相。所选择的物理化学研究,电气测量(薄层电阻,电阻的热温度系数和1 / f噪声与导电填料的种类和含量以及固化温度的关系)和各种稳定性测试已用于完整描述MSCB / PEI((MSCB + G)/ PEI和HSCB / PEI厚膜电阻器系列。已经基于由Balberg概念完成的连续渗流模型对电性能进行了分析,该模型与排除的体积以及聚酯酰亚胺中嵌入的导电晶粒之间距离的功率分布的假设有关。

著录项

  • 来源
    《Microelectronics reliability》 |2007年第3期|354-362|共9页
  • 作者

    Andrzej Dziedzic;

  • 作者单位

    Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology,Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Poland;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 一般性问题;
  • 关键词

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