Isotropic conductive adhesives: Future trends, possibilities and risks

摘要

This brief summary of the questions facing isotropic conductive adhesives is intended to provoke discussion in the research community, and suggest future research priorities. The primary impediment to widespread industrial adoption of the technology is a lack of confidence in its reliability, specifically in its drop-test performance. The key to solving any such technical problem is to fully understand the technology, but at this point there are still far too many fundamental questions on multiple aspects of it to inspire confidence. Some basic research questions are identified, the answers to which should lead to improved product performance.