Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition

摘要

In this paper the response spectra analysis is introduced to obtain transient structural responses of an undamped multiple degrees of freedom structural system subjected to an impact acceleration pulse of a half-sine waveform. The JEDEC drop test condition B is specifically chosen to investigate transient structural responses of a board-level test vehicle comprised of a test board and a mounted package during the drop impact process. Comparisons are made between computed and measured longitudinal strains on the test board as well as time integration and response spectra solutions for stresses in the solder joint.