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PMOS breakdown effects on digital circuits - Modeling and analysis

机译:PMOS击穿对数字电路的影响-建模和分析

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摘要

The degradations in the pMOS device due to gate oxide breakdown introduced by voltage stress were investigated experimentally. The stress-induced shifts in gate leakage and I-V characteristics were presented. A combined Verilog-A and sub-circuit model was first time introduced and employed to simulate the pMOS breakdown behaviors. The Verilog-A model can accurately simulate the power law characteristics of breakdown gate leakage current with a fractional coefficient. With the developed model, the simulated results and the measurements have good agreements. The traditional logic circuits, such as the inverter and the latch, have been investigated through Cadence simulations with the improved models. The latch suffers from the gate oxide breakdown significantly. The NULL Convention Logic (NCL) circuit has also been examined and analyzed systematically. The results showed substitute degradations due to the pMOS gate oxide breakdown.
机译:实验研究了由于电压应力引起的栅氧化物击穿导致的pMOS器件的退化。提出了应力引起的栅极泄漏和I-V特性的变化。首次引入了组合的Verilog-A和子电路模型,并用于模拟pMOS击穿行为。 Verilog-A模型可以精确地模拟具有小数系数的击穿栅极泄漏电流的功率定律特性。使用开发的模型,模拟结果和测量结果具有良好的一致性。通过改进模型的Cadence仿真研究了传统的逻辑电路,例如反相器和锁存器。闩锁明显遭受栅极氧化物击穿。 NULL约定逻辑(NCL)电路也已得到系统地检查和分析。结果表明,由于pMOS栅极氧化物击穿,替代品退化。

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