Thermal resistance assessment in multi-trenched power devices

摘要

For the first time the thermal resistance (R_(th)) of Multi-Trenched (MT) power devices is evaluated and compared with their Deep Trench Isolation flanked (DTI-flanked) and bulk counterparts. The R_(th) extraction is carried out by adapted test structures based on the four-point heater/sensor method. Additional TCAD simulation supports the experimental stationary values and proves that dynamic heating can limit the MT power devices energy capability.