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Unusual defects, generated by wafer sawing: Diagnosis, mechanisms and how to distinguish from related failures

机译:晶圆切割产生的异常缺陷:诊断,机制以及如何与相关故障区分开

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摘要

In the wafer sawing process, unusual failures were observed and their root causes have been investigated. Besides classical and well-known failures, the following failure mechanisms were found. Surface-ESD (ESDFOS), caused by charged water drops and friction electricity of blue carrier foils, ultrasonic cleaning-induced splittering of small surface structures and EEPROM memory loss. Some examples allow valuable conclusions for failure analysis and perform hints how to reduce or eliminate the problem by tool modifications.
机译:在晶圆锯切过程中,观察到了异常的故障,并研究了其根本原因。除了经典的和众所周知的故障,还发现了以下故障机制。表面静电放电(ESDFOS),是由带电的水滴和蓝色载体箔片的摩擦电,超声清洗引起的小表面结构的分离以及EEPROM存储器损耗引起的。一些示例可以为故障分析提供有价值的结论,并提示如何通过工具修改来减少或消除问题。

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