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首页> 外文期刊>Microelectronics reliability >Experimental evidence of 'latent gate oxide damages' in medium voltage power MOSFET as a result of heavy ions exposure
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Experimental evidence of 'latent gate oxide damages' in medium voltage power MOSFET as a result of heavy ions exposure

机译:由于重离子暴露而在中压功率MOSFET中“​​潜在栅极氧化物损坏”的实验证据

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摘要

The results presented in this paper are related to an experimental study that has the aim to evidence the formation of "latent gate oxide damages" in medium voltage power MOSFETs during the impact with energetic particles. The understanding of these "latent defectiveness" can be an helpful aid in the comprehension of the mechanisms of breach of the oxide layer of MOS structures induced by single energetic particles impact (single event gate rupture). To properly detect the presence of "latent damages" we have developed a high resolution experimental set-up and identified an appropriate region in which the device have to be biased in order to trigger this kind of damage.
机译:本文提出的结果与一项实验研究有关,目的是证明在高能粒子撞击过程中,中压功率MOSFET中“​​潜在的栅极氧化物损伤”的形成。对这些“潜在缺陷”的理解可能有助于理解由单个高能粒子撞击(单事件门破裂)引起的MOS结构的氧化层破坏机理。为了正确检测“潜在损害”的存在,我们开发了高分辨率的实验装置,并确定了一个适当的区域,在该区域中必须对设备进行偏置以触发此类损害。

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