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Generic simulator for faulty IC

机译:IC故障的通用模拟器

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Soft defect impact on electrical characteristics is becoming a key issue for device analysis after reliability test as well as for products coming back from the field. Simulating the effect of defects plays a key role. Unfortunately, the complexity of the devices induces a long simulation time, while technology information is not always available at end user side, especially regarding very deep submicron CMOS technology. Having a fast and efficient generic simulator is of great interest for reliability test. In this paper, by comparing the design kit model from ST Microelectronics to the BSIM4 compact model on Microwind3.0, we will show the possibility to run fast simulations with a generic simulation tool. The final application of this generic simulator is to obtain the dynamic behavior in light emission on the failed structures.
机译:软缺陷对电气特性的影响已成为可靠性测试后的器件分析以及现场退回产品的关键问题。模拟缺陷的影响起着关键作用。不幸的是,设备的复杂性导致了较长的仿真时间,而最终用户端并不总是可以获得技术信息,尤其是对于非常深的亚微米CMOS技术而言。对于可靠性测试,拥有快速高效的通用模拟器非常重要。在本文中,通过将ST Microelectronics的设计套件模型与Microwind3.0上的BSIM4紧凑模型进行比较,我们将展示使用通用仿真工具进行快速仿真的可能性。该通用模拟器的最终应用是获得故障结构上发光的动态行为。

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