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Characterization of defects in flexible circuits with ultrasonic atomic force microscopy

机译:超声原子力显微镜表征柔性电路中的缺陷

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摘要

Flexible circuit technology is a key factor in the continued shrinkage of microelectronic components and devices. One of the important applications of the flexible circuits is in hard disk drive industry, where they are used as an interconnection between the preamplifier and head slider assembly of a hard disk drive. At present, defect characterization of flexible circuits is often performed after manufacture usually with optical microscopy. While this may be sufficient for certain low-tech applications, for advanced ultra high-density hard disk components may not be enough. With a continuing reduction of the dimension of the current carrying conductor wires, the size of defects that may affect long-term reliability of the system is reaching the resolution limit of traditional techniques used to characterize the defects. This paper presents combined application of atomic force microscope (AFM) and ultrasonic atomic force microscope (UAFM) to characterize defects in flexible circuits. Three identical flexible circuits from different manufactures are examined using AFM and UAFM. The AFM and UAFM images of a particular region, in the flexible circuit in all the three samples are compared. Images from pure polymer region of the flexible circuit are compared with the images of the regions containing copper and polymer. In general, the UAFM images show subsurface features while AFM images show surface topography. This capability of UAFM can be used to image the grain structure of the copper film without removing the polymer cover layer film. It also detects the sub-micron defects present at the polymer/metal interface. Analysis of the grain structure of copper, distribution of defects at the polymer/metal interface is presented. Based on these observations, the applicability of AFM/UAFM to image the microstructure of copper in flexible circuits and possible effect of defects in flexible circuits on the long-term reliability of the hard disc drive are discussed.
机译:柔性电路技术是微电子元件和器件持续缩小的关键因素。柔性电路的重要应用之一是在硬盘驱动器工业中,它们被用作硬盘驱动器的前置放大器和磁头滑块组件之间的互连。目前,通常在制造后通常使用光学显微镜对柔性电路进行缺陷表征。尽管这对于某些低技术应用可能已足够,但对于高级超高密度硬盘组件可能还不够。随着载流导线的尺寸的持续减小,可能影响系统的长期可靠性的缺陷的尺寸已达到用于表征缺陷的传统技术的分辨率极限。本文介绍了原子力显微镜(AFM)和超声原子力显微镜(UAFM)的组合应用,以表征柔性电路中的缺陷。使用AFM和UAFM检查了来自不同制造商的三个相同的柔性电路。比较所有三个样本中柔性电路中特定区域的AFM和UAFM图像。将来自柔性电路的纯聚合物区域的图像与包含铜和聚合物的区域的图像进行比较。通常,UAFM图像显示地下特征,而AFM图像显示表面形貌。 UAFM的这种功能可用于对铜膜的晶粒结构进行成像,而无需去除聚合物覆盖层膜。它还可以检测存在于聚合物/金属界面的亚微米缺陷。分析了铜的晶粒结构,分析了聚合物/金属界面处的缺陷分布。基于这些观察,讨论了AFM / UAFM对柔性电路中的铜的微观结构成像的适用性以及柔性电路中的缺陷对硬盘驱动器长期可靠性的可能影响。

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