Microelectronics Reliability-Guide for Authors

摘要

By E-mail: A full set of files (in PDF or Microsoft Word format) and cover e-mail should be sent to one of the Editors-in-Chief or to the appropriate Regional Editor. By Mail: Manuscripts (1 original, 1 copy and an electronic version on disk) accompanied by a covering letter should be sent to one of the Editors-in-Chief or to the appropriate Regional Editor.