Dynamic study of the thermal laser stimulation response on advanced technology structures

摘要

Thermal laser stimulation on sub-Micronics interconnection structures is well known. The usual approach is to consider them as a resistor, whatever the structure is. We experimentally showed the weaknesses of this assumption which has to be reconsidered. In this paper we develop a new analytical model based on fine characterization of the dynamic behavior structure heated and cooled. In addition to a better understanding of thermal laser stimulation signature, this modelization opens a wide range of application: structure identification, 3-D localization, etc. It should be a key for failure analysis accuracy and efficiency on Back End Of the Line test structures.