Guest Editorial: 2007 EuroSimE conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

摘要

This special issue includes selected papers presented at the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). This year the conference was organised in London (England) thanks to local organizer Prof. Chris Bailey from University of Greenwich.The annual EuroSimE conference was initiated in 2000 as the only international conference with direct focus on Thermal, Mechanical and Multi-Physics Simulations and Experiments in Micro-Electronics and Micro-Systems. Each year Technical Committee makes a substantial effort to provide high quality papers, presentations, exhibitions and workshops, which highlight the major research, technological and industrial development trends, challenges and roadmaps.