首页> 外文期刊>Microelectronics reliability >Suppression of Ge-O and Ge-N bonding at Ge-HfO_2 and Ge-TiO_2 interfaces by deposition onto plasma-nitrided passivated Ge substrates: Integration issues Ge gate stacks into advanced devices
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Suppression of Ge-O and Ge-N bonding at Ge-HfO_2 and Ge-TiO_2 interfaces by deposition onto plasma-nitrided passivated Ge substrates: Integration issues Ge gate stacks into advanced devices

机译:通过沉积到等离子氮化钝化Ge衬底上来抑制Ge-HfO_2和Ge-TiO_2界面处的Ge-O和Ge-N键合:集成问题将Ge栅堆叠集成到高级器件中

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摘要

A study of changes in nano-scale morphology of thin films of nano-crystalline transition metal (TM) elemental oxides, HfO_2 and TiO_2, on plasma-nitrided Ge(100) substrates, and Si(100) substrates with ultra-thin (~0.8 nm) plasma-nitrided Si suboxide, SiO
机译:等离子氮化Ge(100)和Si(100)超薄(〜)衬底上的纳米晶体过渡金属(TM)元素氧化物HfO_2和TiO_2薄膜的纳米级形貌变化的研究0.8 nm)等离子体氮化的Si氧化物

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