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Impact of O-Si-O bond angle fluctuations on the Si-O bond-breakage rate

机译:O-Si-O键角波动对Si-O键断裂率的影响

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摘要

We extend the McPherson model for the silicon-oxygen bond-breakage in a manner to capture the impact of the O-Si-O angle fluctuations (typical for amorphous SiO_2) on the breakage rate. In the McPherson model the transition of the Si ion from the 4-fold coordinated position to the 3-fold coordination is considered as rupture of the Si-O bond. We have studied the potential barrier (separating these saddle points) transformation induced by the O-Si-O bond angle variations and found that the secondary minimum occurs at a critical angle of about 107.75°. Since the Si ion "finds" the way corresponding to the highest breakage probability we used the two-dimensional downhill simplex method in order to find the direction of this maximal rate. It was shown that if the O-Si-O angle deviates from its nominal value 109.48° (typical for α-quartz) corresponding to the regular SiO_4 tetrahedron the symmetry aggravates and the secondary minimum is rotated. Calculated dependencies of the breakage rate on the electric field demonstrate the linear slope in the log-lin scale thus reflecting the linear reduction of the activation energy for the bond-breakage vs. field. The family of distribution functions for breakage rate calculated with a fixed step of field shows that the curves do not change their form and are shifted in parallel with the field. This tendency supports the thermo-chemical model for the bond-breakage also in the case of strongly fluctuating O-Si-O angles. As a consequence, dependencies of the mean value of the rate, its standard deviation and the nominal rate (calculated for the angle of 109.48°) have the same slope on a log-lin scale. The wide spread of the breakage rate is reflected by the high value of its standard deviation.
机译:我们扩展了McPherson模型用于硅-氧键断裂,以捕获O-Si-O角度波动(对于非晶SiO_2典型)对断裂率的影响。在麦克弗森模型中,Si离子从4倍配位到3倍配位的转变被认为是Si-O键的断裂。我们研究了由O-Si-O键角变化引起的势垒(分离这些鞍点),发现次要最小值出现在约107.75°的临界角上。由于Si离子“找到”了与最高破损概率相对应的方式,因此我们使用了二维下坡单纯形法来找到该最大速率的方向。结果表明,如果O-Si-O角偏离其对应于常规SiO_4四面体的标称值109.48°(α-石英的典型值),对称性就会加剧,并且次要最小值会旋转。断裂率对电场的计算依赖性证明了对数-林尺度上的线性斜率,因此反映了键断裂对场的活化能的线性降低。用固定的电场步长计算的破损率分布函数族表明,曲线不会改变其形式,而是与电场平行移动。这种趋势在O-Si-O角度剧烈波动的情况下也支持了键断裂的热化学模型。结果,速率平均值,其标准偏差和标称速率(针对109.48°的角度计算)的依赖性在对数林尺上具有相同的斜率。破损率的广泛分布反映在其标准偏差的高值上。

著录项

  • 来源
    《Microelectronics reliability 》 |2009年第11期| 998-1002| 共5页
  • 作者单位

    Christian Doppler Laboratory for TCAD, Technische Universitaet Wien, Gusshausstrasse 27-29/E 360, A-1040 Vienna, Austria;

    Institute for Microelectronics, Technische Universitaet Wien, Gusshausstrasse 27-29/E 360, A-1040 Vienna, Austria;

    Christian Doppler Laboratory for TCAD, Technische Universitaet Wien, Gusshausstrasse 27-29/E 360, A-1040 Vienna, Austria;

    Christian Doppler Laboratory for TCAD, Technische Universitaet Wien, Gusshausstrasse 27-29/E 360, A-1040 Vienna, Austria;

    Christian Doppler Laboratory for TCAD, Technische Universitaet Wien, Gusshausstrasse 27-29/E 360, A-1040 Vienna, Austria;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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