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Reading distance degradation mechanisms of near-field RFID devices

机译:近场RFID设备的读取距离衰减机制

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摘要

In case of operation distance degradation, frequently RFID chips are extracted from their tags and electrically/physically analysed. However, manifold mechanisms based on interaction effects between package and device, exist. This paper examines and highlights these mechanisms, giving also valuable hints for the failure analyst.
机译:在操作距离降低的情况下,经常从其标签中提取RFID芯片并进行电/物理分析。然而,存在基于封装和器件之间的相互作用效应的多种机制。本文研究并重点介绍了这些机制,也为故障分析人员提供了宝贵的提示。

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  • 来源
    《Microelectronics reliability》 |2009年第11期|1288-1292|共5页
  • 作者单位

    EMPA Swiss Federal Labs for Materials Testing and Research, Ueberlandstr 129, 8600 Duebendorf, Switzerland EM Microelectronic Marin SA, Rue des Sors 2-3, 2074 Marin, Switzerland;

    EMPA Swiss Federal Labs for Materials Testing and Research, Ueberlandstr 129, 8600 Duebendorf, Switzerland;

    EMPA Swiss Federal Labs for Materials Testing and Research, Ueberlandstr 129, 8600 Duebendorf, Switzerland;

    EMPA Swiss Federal Labs for Materials Testing and Research, Ueberlandstr 129, 8600 Duebendorf, Switzerland;

    Sokymat Automotive, Gewerbeparkstr 10, 51580 Reichshof-Welmrath, Germany;

    Datamars SA, Via ai Prati, 6930 Bedano-Lugano, Switzerland;

    Datamars SA, Via ai Prati, 6930 Bedano-Lugano, Switzerland;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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