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Dielectric thinning model applied to metal insulator metal capacitors with Al_2O_3 dielectric

机译:介电减薄模型应用于具有Al_2O_3介电常数的金属绝缘体金属电容器

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摘要

The extrinsic fails of metal insulator metal capacitors (MIMCAPs) with Al_2O_3 dielectric are modeled by a thinning model that is based on the intrinsic reliability model and the assumption that the extrinsic fails behave like an intrinsic dielectric with a reduced thickness. The intrinsic reliability model is developed from voltage acceleration experiments at four temperatures and four dielectric thicknesses. Voltage and thickness dependence of the logarithm of the intrinsic lifetime scales with the electric field and the temperature dependence is described by an Arrhenius factor. The voltage acceleration is not temperature dependent. The thinning model is shown to consistently describe acceleration experiments with random extrinsic fails of unknown root cause at low defect density (0.1 cm~(-2)) as well as a systematic extrinsic failure mechanism caused by process induced plasma damage. It is also shown that the random extrinsic fails that were investigated on large area teststructures can be extrapolated to much smaller product typical capacitors. A criteria based on the stored energy is derived that allows to decide, whether an extrinsic fail will cause product failure. These results allow a quantitative prediction of early product fails due to the MIMCAP.
机译:具有Al_2O_3电介质的金属绝缘体金属电容器(MIMCAP)的外部失效通过基于固有可靠性模型的稀化模型进行建模,并且假设外部失效的行为类似于厚度减小的固有电介质。固有可靠性模型是通过在四个温度和四个电介质厚度下的电压加速实验开发的。固有寿命的对数的电压和厚度依赖性与电场成比例,而温度依赖性由阿伦尼乌斯(Arrhenius)因子描述。电压加速度与温度无关。稀疏模型显示出始终如一地描述加速试验,该试验具有在低缺陷密度(0.1 cm〜(-2))下未知的根本原因的随机外在破坏,以及由过程引起的等离子体损伤引起的系统外在破坏机制。还表明,在大面积测试结构上研究的随机外部失效可以外推到小得多的典型电容器上。基于存储的能量得出一个标准,该标准允许确定外部故障是否会导致产品故障。这些结果可以定量预测由于MIMCAP而导致的早期产品故障。

著录项

  • 来源
    《Microelectronics reliability 》 |2009年第12期| 1520-1528| 共9页
  • 作者单位

    Infineon Technologies AG, Reliability Methodology, Otto Hahn Ring 6, 81739 Muenchen, Germany;

    Infineon Technologies AG, Reliability Methodology, Otto Hahn Ring 6, 81739 Muenchen, Germany;

    Infineon Technologies AG, Reliability Methodology, Otto Hahn Ring 6, 81739 Muenchen, Germany;

    Infineon Technologies AG, Reliability Methodology, Otto Hahn Ring 6, 81739 Muenchen, Germany;

    Infineon Technologies AG, Reliability Methodology, Otto Hahn Ring 6, 81739 Muenchen, Germany;

    Infineon Technologies AG, Reliability Methodology, Otto Hahn Ring 6, 81739 Muenchen, Germany;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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