机译:球栅阵列封装中掺银纳米粒子的Sn-9Zn焊料的界面微观结构和剪切强度
Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong;
Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong;
Department of Materials and Metallurgical Engineering, Bangladesh University of Engineering and Technology, Dhaka-100, Bangladesh;
Department of Biology and Chemistry, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong;
Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong;
机译:纳米镍添加量对Au / Ni / Cu球栅阵列封装中Sn-9Zn和Sn-Zn-3Bi焊料的结构和性能的影响
机译:带有Au / Ni / Cu和Ag / Cu焊盘的回流和老化的Sn-9Zn焊球网格阵列封装中的金属间反应
机译:铜焊盘上Au / Ni金属化的晶圆级芯片尺寸封装的界面微观结构和焊球剪切强度的时效研究
机译:纳米Ni添加对球栅阵列包装中Sn-9Zn和Sn-8Sn-3Bi焊料的结构和性能的影响
机译:用共晶铅锡和无铅焊料对塑料球栅阵列,芯片规模和倒装芯片封装的焊球剪切强度进行调查和分析。
机译:使用Sn纳米粒子增强焊膏焊接无源部件:对微观结构和关节强度的影响
机译:球栅阵列封装中掺银纳米粒子的Sn-9Zn焊料的界面微观结构和剪切强度