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机译:边缘键合无铅芯片级封装的跌落冲击可靠性
Cal Poly State University, 1 Grand Avenue, San Luis Obispo, CA 93407, USA;
Cal Poly State University, 1 Grand Avenue, San Luis Obispo, CA 93407, USA;
Cal Poly State University, 1 Grand Avenue, San Luis Obispo, CA 93407, USA;
Cal Poly State University, 1 Grand Avenue, San Luis Obispo, CA 93407, USA;
Cal Poly State University, 1 Grand Avenue, San Luis Obispo, CA 93407, USA;
Henkel Corporation, 15350 Barranca Parkway, Irvine, CA 92618, USA;
Henkel Corporation, 15350 Barranca Parkway, Irvine, CA 92618, USA;
Flextronics International, 2090 Fortune Drive, San Jose, CA 95131, USA;
Flextronics International, 2090 Fortune Drive, San Jose, CA 95131, USA;
Flextronics International, 2090 Fortune Drive, San Jose, CA 95131, USA;
Flextronics International, 2090 Fortune Drive, San Jose, CA 95131, USA;
机译:无铅芯片级封装:组装和跌落测试的可靠性
机译:印刷线路板涂料对无铅芯片级封装互连可靠性的影响
机译:受热循环影响的边缘和角接合无铅芯片级封装组件的板级焊点可靠性
机译:在不同尺寸无铅晶圆级芯片刻度套件上降低可靠性测试
机译:芯片级封装和01005组件的无铅组装和可靠性。
机译:具有量子点转换器的高均匀性平面微型芯片级封装LED用于白光源
机译:边缘键合无铅芯片级封装的跌落冲击可靠性
机译:混合包装的共晶和无铅的可靠性和粘贴工艺优化