Fast diffusers in a thermal gradient (solder ball)

J.R. Lloyd; N.A. Connelly; Xiaoli He; K.J. Ryan; B.H. Wood

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Fast diffusers in a thermal gradient (solder ball)

机译：热梯度中的快速扩散器（焊球）

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摘要

The behaviour of Ni in Sn under a thermal gradient driving forces was calculated considering boundary conditions typical of lead-free solder applications. The steady state concentration profiles for a fast dif-fuser were determined and the consequences for reliability discussed.

机译：考虑到无铅焊料应用的典型边界条件，计算了在热梯度驱动力下锡中镍的行为。确定了快速扩散器的稳态浓度曲线，并讨论了可靠性的后果。

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来源
《Microelectronics & Reliability》 |2010年第11期|p.1355-1358|共4页
作者
J.R. Lloyd; N.A. Connelly; Xiaoli He; K.J. Ryan; B.H. Wood;
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作者单位

SUNY Albany, College of Nanoscale Science and Engineering, 257 Fuller Road, Albany NY 12203, USA;

rnSUNY Albany, College of Nanoscale Science and Engineering, 257 Fuller Road, Albany NY 12203, USA;

rnSUNY Albany, College of Nanoscale Science and Engineering, 257 Fuller Road, Albany NY 12203, USA;

rnSUNY Albany, College of Nanoscale Science and Engineering, 257 Fuller Road, Albany NY 12203, USA;

rnSUNY Albany, College of Nanoscale Science and Engineering, 257 Fuller Road, Albany NY 12203, USA;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
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Fast diffusers in a thermal gradient (solder ball)

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