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机译:FinFET器件中由于热载流子效应引起的界面状态分布的温度依赖性
TSRC, Institute of Microelectronics, School of Electronic Engineering and Computer Science, Peking University, Beijing 100871, PR China The Key Laboratory of Integrated Microsystems, School of Computer & Information Engineering, Peking University Shenzhen Graduate School, Shenzhen 518055, PR China;
rnTSRC, Institute of Microelectronics, School of Electronic Engineering and Computer Science, Peking University, Beijing 100871, PR China;
rnTSRC, Institute of Microelectronics, School of Electronic Engineering and Computer Science, Peking University, Beijing 100871, PR China;
rnTSRC, Institute of Microelectronics, School of Electronic Engineering and Computer Science, Peking University, Beijing 100871, PR China;
rnTSRC, Institute of Microelectronics, School of Electronic Engineering and Computer Science, Peking University, Beijing 100871, PR China The Key Laboratory of Integrated Microsystems, School of Computer & Information Engineering, Peking University Shenzhen Graduate School, Shenzhen 518055, PR China Peking University Shenzhen SOC Key Laboratory, PKU HKUST Shenzhen Institute, W303, West Tower, IER Bldg, Hi-Tech Industrial Park South, Shenzhen 518057, PR China;
rnTSRC, Institute of Microelectronics, School of Electronic Engineering and Computer Science, Peking University, Beijing 100871, PR China The Key Laboratory of Integrated Microsystems, School of Computer & Information Engineering, Peking University Shenzhen Graduate School, Shenzhen 518055, PR China;
机译:基于物理模型来预测FinFET的性能下降,并考虑到由于热载流子注入引起的界面状态分布效应
机译:Finfet器件中串联电阻和载流子迁移率的栅极电压和几何形状相关性
机译:晶界对含有大晶粒的低温多晶硅薄膜晶体管中器件特性的温度依赖性和热载流子效应的影响
机译:FinFET中热载流子降解(HCD)的非普遍温度依赖性:新观察和物理理解
机译:SOI设备的接口特性和热载流子效应
机译:界面涨落GaN量子点的单光子发射的温度依赖性
机译:器件缩放对热载流子感应界面和MOSFET中氧化物陷阱电荷分布的影响