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A model for the critical voltage for electrical degradation of GaN high electron mobility transistors

机译:GaN高电子迁移率晶体管电降解的临界电压模型

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摘要

It has recently been postulated that GaN high electron mobility transistors under high voltage stress degrade as a result of defect formation induced by excessive mechanical stress that is introduced through the inverse piezoelectric effect. This mechanism is characterized by a critical voltage beyond which irreversible degradation takes place. In order to improve the electrical reliability of GaN HEMTs, it is important to understand and model this degradation process. In this paper, we formulate a first-order model for mechanical stress and elastic energy induced by the inverse piezoelectric effect in GaN HEMTs which allows the computation of the critical voltage for degradation in these devices.
机译:最近已经推测,高压应力下的GaN高电子迁移率晶体管由于通过反向压电效应引入的过大机械应力引起的缺陷形成而退化。该机制的特征在于临界电压,超过该临界电压会发生不可逆的退化。为了提高GaN HEMT的电可靠性,重要的是了解和建模这种降解过程。在本文中,我们为GaN HEMT中逆压电效应引起的机械应力和弹性能建立了一阶模型,从而可以计算出这些器件中的退化临界电压。

著录项

  • 来源
    《Microelectronics reliability 》 |2010年第6期| 767-773| 共7页
  • 作者单位

    Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA United States 60 Vassar St., Rm. 39-615, Cambridge, MA 02139, United States;

    rnMicrosystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA United States;

    rnMicrosystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA United States;

    rnMicrosystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA United States;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    GaN; HEMT; critical voltage; degradation; reliability; modeling;

    机译:氮化镓;HEMT;临界电压降解;可靠性;造型;

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