机译:在划片过程中促进带电设备模型/抗静电放电
Institute of Mechatronic Engineering, National Taipei University of Technology, Taipei, Taiwan Department of Electronic Engineering, Ming-Hsin University of Science and Technology, No. 1 Hsin-Hsing Road, Hsin-Fong, Hsin-Chu 304, Taiwan;
rnDepartment of Mechatonic Technology, National Taiwan Normal University, 162, He-ping East Road, Section 1, Taipei 10610. Taiwan;
rnDepartment of Electronic Engineering, Ming-Hsin University of Science and Technology, No. 1 Hsin-Hsing Road, Hsin-Fong, Hsin-Chu 304, Taiwan;
rnInstitute of Mechatronic Engineering, National Taipei University of Technology, Taipei, Taiwan;
rnInstitute of Mechatronic Engineering, National Taipei University of Technology, Taipei, Taiwan;
rnDepartment of Electronic Engineering, Ming-Hsin University of Science and Technology, No. 1 Hsin-Hsing Road, Hsin-Fong, Hsin-Chu 304, Taiwan;
rnInstitute of Mechatronic Engineering, National Taipei University of Technology, Taipei, Taiwan;
complementary metal-oxide-semiconductor; electrostatic discharges; packaging; charged-device model; semiconductor-insulator;
机译:p-SMAD2 / 3和DICER在压力超负荷相关的心肌重塑过程中促进pre-miR-21加工
机译:进场物体的静电放电(ESD)的通用模型:多次放电和进场速度的分析(转载于《电气过应力/静电放电研讨会论文集》,2000年)
机译:用于静电分离过程的三电极系统的电晕放电建模
机译:使用统一电路建模技术模拟静电放电抗扰度的框架
机译:系统和IC级别的静电放电(ESD)和电快速瞬变(EFT)免疫力分析以及相关的耦合机制。
机译:Dicer对HIV-1 TAR元件进行处理以产生参与病毒LTR染色质重塑的病毒微RNA
机译:p-SMAD2 / 3和DICER在压力超负荷相关的心肌重塑过程中促进pre-miR-21加工