Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package

摘要

Proximity Communication (PxC) facilitates the integration of VLSI chips in a package using near-field capacitive coupling between chips, eliminating the need for solder or wires for I/O at the chip-to-chip interface. PxC provides chip-to-chip interconnect with bandwidth density and energy per bit similar to on-chip I/O, enabling system on a chip performance within a package. We have built early packages to explore assembly concepts and developed test methods for verification of the PxC design space. This package started with an adhesively-bonded three-chip subassembly of two Island chips and one Bridge chip. The two outer Island chips were reflowed to an alumina ceramic substrate. In the resulting package, communication between chips was achieved using PxC from Island to Bridge and then from the Bridge to the other Island. We demonstrated the ability to detect the X, Y, and 2 chip-to-chip relative location and the ability to steer PxC data to optimize signal integrity within the package. This paper describes the first demonstration of active monitoring of chip-to-chip alignment during thermal cycling, in a PxC-enabled package. Leveraging this work, future packages will better exploit PxC benefits such as free-space electrical interconnect and re-workability of multi-chip modules.