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Total-dose-induced edge effect in SOI NMOS transistors with different layouts

机译:不同布局的SOI NMOS晶体管中总剂量引起的边缘效应

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摘要

The total-dose-induced edge effect in SOI NMOS transistors with different layouts is presented. Experimental results show that the edge effect is very sensitive to their layouts. Among the transistors hardened by design, the H-gate and ringed-source transistors do not behave as expected. At high radiation doses, the edge leakage currents appear for both transistors. Compared to the unhardened two-edged transistor, their total-dose-induced edge leakage paths and the role of layouts on edge effect are discussed.
机译:提出了具有不同布局的SOI NMOS晶体管中总剂量引起的边缘效应。实验结果表明,边缘效应对其布局非常敏感。在经过设计硬化的晶体管中,H栅极和环形源极晶体管的行为不符合预期。在高辐射剂量下,两个晶体管都出现边缘泄漏电流。与未硬化的两边缘晶体管相比,讨论了它们的总剂量引起的边缘泄漏路径以及布局对边缘效应的作用。

著录项

  • 来源
    《Microelectronics reliability 》 |2010年第1期| 45-47| 共3页
  • 作者单位

    School of Physics Science and Technology, Central South University, Changsha 410083, China China CEPREI Laboratory, Guangzhou 510610, China School of Material Science and Technology, Central South University, Changsha 410083, China;

    School of Physics Science and Technology, Central South University, Changsha, Hunan 410083, China;

    China CEPREI Laboratory, Guangzhou 510610, China;

    China CEPREI Laboratory, Guangzhou 510610, China;

    China CEPREI Laboratory, Guangzhou 510610, China;

    China CEPREI Laboratory, Guangzhou 510610, China;

    China CEPREI Laboratory, Guangzhou 510610, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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