A brief review of selected aspects of the materials science of ball bonding

摘要

Thermosonic ball bonding is a metallurgical process that until recently was rarely the subject of metallurgical analysis. However, in recent years greater focus has been given to the materials science of thermosonic ball-wedge bonding in an attempt to better control and advance its application as an interconnect technology in advanced packaging. As with most materials processes, establishing a scientific understanding of the process requires knowledge from various sub-disciplines of physical science. This article briefly reviews selected aspects of the materials science of ball bonding, focussing on 1st and 2nd bond formation and intermetallic growth.