From component to system failure analysis - The future challenge within work-sharing supply chains

摘要

Up to now, failure analysis focuses on electronic components. Few publications proceed towards subsystems like PCBs, MCMs and new package-related subsystems. But the major challenge of the future will be dedicated to systems, where component analysis is one of the analysis entries but not the home stretch toward root cause finding. Case studies from wind power-, automotive- and traction-electronics show this major failure analysis trend change in a demonstrative manner.