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Matching degradation of threshold voltage and gate voltage of NMOSFET after Hot Carrier Injection stress

机译:热载流子注入应力后,NMOSFET的阈值电压和栅极电压的匹配退化

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摘要

Device degradation modelling is more and more important for reliable circuit design. On MOSFET, the threshold voltage drift in time can lead to circuit performance degradation. In this study, VT shift due to Hot Carrier Injection stress is accelerated on small width devices. VT matching is also degraded during stress as a function of VT deterioration. This width dependence allows explaining gate voltage matching behavior in the sub-threshold area used in low power analog applications.
机译:器件降级建模对于可靠的电路设计越来越重要。在MOSFET上,阈值电压随时间的漂移会导致电路性能下降。在这项研究中,在小宽度器件上,由于热载流子注入应力引起的VT位移被加速。在应力作用下,VT匹配也会随着VT劣化而降低。这种宽度依赖性可以解释在低功率模拟应用中使用的亚阈值区域中的栅极电压匹配行为。

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  • 来源
    《Microelectronics reliability》 |2011年第11期|p.1561-1563|共3页
  • 作者单位

    STMicroelectronics, 190 Avenue Celestin Coq Zone Industrielle, 13106 Rousset, France,M2NP Laboratory (UMR CNRS 6242), 38 rue Frederic Joliot Curie, 13451 Marseille, France;

    STMicroelectronics, 190 Avenue Celestin Coq Zone Industrielle, 13106 Rousset, France;

    M2NP Laboratory (UMR CNRS 6242), 38 rue Frederic Joliot Curie, 13451 Marseille, France;

    M2NP Laboratory (UMR CNRS 6242), 38 rue Frederic Joliot Curie, 13451 Marseille, France;

    STMicroelectronics, 190 Avenue Celestin Coq Zone Industrielle, 13106 Rousset, France;

    STMicroelectronics, 190 Avenue Celestin Coq Zone Industrielle, 13106 Rousset, France;

    STMicroelectronics, 190 Avenue Celestin Coq Zone Industrielle, 13106 Rousset, France;

    STMicroelectronics, 190 Avenue Celestin Coq Zone Industrielle, 13106 Rousset, France;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
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  • 正文语种 eng
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