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S-parameter performance degradation in power RF N-LDMOS devices due to hot carrier effects

机译:由于热载流子效应,功率RF N-LDMOS器件的S参数性能下降

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摘要

This paper reports comparative study of technology reliability after accelerated ageing tests under various conditions (electrical and/or thermal stress) and RF life-tests reliability with pulsed bench for radar applications in S-band. It is important to understand the effects of the reliability degradation mechanisms on the S-parameters and in turn on static and dynamic parameters. The analysis of the experimental results is presented and the physical processes responsible for the observed degradation at different stress conditions are studied by means of 2D ATLAS-SILVACO simulations. S-parameters degradation of hot-carrier stressed n-MOS transistors can be explained by the transcon-ductance and miller capacitance shifts, which are resulted from the interface state generation (traps), which results in a build up of negative charge at Si/SiO_2 interface. More interface states are created due to a located maximum impact ionization rate at the gate edge. From our experimental results, hot electron induced RF performance degradation should be taken into consideration in the design of the power RF MOS devices.
机译:本文报告了在各种条件(电和/或热应力)下加速老化测试后技术可靠性的比较研究,以及用于S波段雷达应用的脉冲工作台的RF寿命测试可靠性。重要的是要了解可靠性降低机制对S参数的影响,以及对静态和动态参数的影响。给出了实验结果的分析,并通过2D ATLAS-SILVACO模拟研究了导致在不同应力条件下观察到的降解的物理过程。热载流子应力n-MOS晶体管的S参数劣化可以通过跨导和米勒电容偏移来解释,这是由于界面态的产生(陷阱)导致的,从而导致在Si /处形成负电荷。 SiO_2界面。由于在栅极边缘处定位了最大碰撞电离速率,因此创建了更多的界面状态。根据我们的实验结果,在功率RF MOS器件的设计中应考虑热电子引起的RF性能下降。

著录项

  • 来源
    《Microelectronics reliability》 |2011年第11期|p.1551-1556|共6页
  • 作者单位

    University o/Cabes, 6072 Cabes, Tunisia;

    University o/Cabes, 6072 Cabes, Tunisia;

    CPM-UMR OWS 6634, University of Rouen, 76801 Saint Etienne du Rouvray, France;

    THALES Air Defence, Zl du Mont Janet, 76520 Ymare, France;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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