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Temperature dependent electrical and dielectric properties of Sn/p-Si metal-semiconductor (MS) structures

机译:Sn / p-Si金属半导体(MS)结构的温度依赖性电和介电特性

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摘要

In this study, we investigated temperature dependent electrical and dielectric properties of the Sn/p-Si metal-semiconductor (MS) structures using capacitance-voltage (C-V) and conductance-voltage (G/ω-V) characteristics in the temperature range 80-400 K. The dielectric constant (ε), dielectric loss (ε"), dielectric loss tangent (tan δ) and ac electrical conductivity (σ_ac) were calculated from the C-V and G/ω-V measurements and plotted as a function of temperature. The values of the ε',ε", tan δ and σ_(ac) at low temperature (-80 K) were found to be 0.57, 0.37, 0.56 and 1.04×10~(-7), where as the values of the ε', ε", tan d and σ_ac at high temperature (-400 K) were found to be 0.75, 0.44, 0.59 and 1.21×10~(-6), respectively. An increase in the values of the ε' ε", tan S and σ_(ac) where observed with increase in temperature. Furthermore, the effects of interface state density (N_(ss)) and series resistance (R_s) on C-V characteristics were investigated in the wide temperature range.
机译:在这项研究中,我们使用温度范围80内的电容-电压(CV)和电导-电压(G /ω-V)特性研究了Sn / p-Si金属半导体(MS)结构随温度变化的电和介电特性-400K。介电常数(ε),介电损耗(ε“),介电损耗正切(tanδ)和交流电导率(σ_ac)由CV和G /ω-V测量得出,并作为低温(-80 K)下的ε',ε“,tanδ和σ_(ac)的值为0.57、0.37、0.56和1.04×10〜(-7),其中ε',ε“,tan d和σ_ac在高温(-400 K)下的值分别为0.75、0.44、0.59和1.21×10〜(-6)。 ε“,tan S和σ_(ac)随着温度的升高而观察到。此外,研究了在宽温度范围内界面态密度(N_(ss))和串联电阻(R_s)对C-V特性的影响。

著录项

  • 来源
    《Microelectronics reliability》 |2011年第12期|p.2205-2209|共5页
  • 作者

    Suekrue Karatas; Zekeriya Kara;

  • 作者单位

    Kahramanmaras Suetcue Imam University, Faculty of Sciences and Arts, Department of Physics, 46100 Kahramanmaras, Turkey;

    Kahramanmaras Suetcue Imam University, Faculty of Sciences and Arts, Department of Physics, 46100 Kahramanmaras, Turkey;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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