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机译:层压参数对低温共烧陶瓷带机械性能的影响
Institute of Sensor and Actuator Systems, Vienna University of Technology, Vienna, Austria;
Institute of Sensor and Actuator Systems, Vienna University of Technology, Vienna, Austria;
Institute of Sensor and Actuator Systems, Vienna University of Technology, Vienna, Austria;
Institute of Musical Acoustics, University of Music and Performing Arts, Vienna, Austria;
Institute of Musical Acoustics, University of Music and Performing Arts, Vienna, Austria;
机译:溶剂和基于牺牲体积材料的低温共烧陶瓷带层压工艺的比较
机译:低温共烧陶瓷用Sr_2ZnSi_2O7_基陶瓷-玻璃复合材料的流延铸造和介电性能
机译:高温共烧陶瓷带层压条件的研究
机译:介绍杜邦? GreenTape? 9K5低介电常数,低温共烧陶瓷(LTCC)胶带系统
机译:使用图像处理的低温共射陶瓷在低温共射陶瓷中测量特征收缩变异性
机译:Ca–Al–Si–O普通玻璃对含不同填料的低温共烧陶瓷材料介电性能的影响
机译:低温共烧陶瓷的低温和中介电常数的共用