LTCC package for high temperature applications

摘要

There is a growing demand for sensors and electronics that can work in harsh environments and at high temperature. Applications include sensors and actuators for control in petroleum and geothermal industry, process monitoring and distributed control systems in the automotive and aerospace fields. Process development and packaging materials for electronic devices are closely connected to such packaging issues. In many cases the package is as important as the device itself in meeting the applications needs. Low temperature co-fired ceramics (LTCC) and thick-film technologies have the potential to incorporate multilayer structures, enabling fabrication of specialized packaging systems. LTCC technology enables easy electrical or optical connections within and between layers in addition to enabling use of integrated passive components, heaters, sensors, converters etc. This paper presents attempts to develop a reliable packaging technology for silicon carbide (SiC) based hydrogen sensors operating at temperatures up to 300 ℃ Some simulations of thermal properties were carried out and package structures were made and investigated. The package protects the sensor against mechanical damage and makes possible easy electrical connections. Moreover, the heater and temperature sensors allow for proper temperature regulation of the element. The manufacturing process, basic electrical parameters of the integrated heater as well as real temperature distribution are presented.