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Scaling the bulk-driven MOSFET into deca-nanometer bulk CMOS processes

机译:将批量驱动的MOSFET扩展到十纳米批量CMOS工艺

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摘要

This paper examines the implications of scaling an n-type bulk-driven MOSFET into the 90 nm node in an effort to make the device suitable for analog designs operating at 0.7 V, the minimum supply voltage predicted for the end of bulk CMOS. Observations will suggest that process scaling has caused the g_(mb),/g_m ratio to degrade from 0.38 to 0.12 between representative 0.25 μm and 65 nm technologies and that the benefits expected from traditional bulk-driven circuit architectures are no longer present in deca-nanometer processes unless certain modifications are considered. Furthermore, it will be shown that the major disadvantages of the bulk-driven MOSFET - i.e., its low intrinsic gain, low cut-off frequency and layout area requirements - can be improved by as much as 110%, 50% and 53%, respectively, if delta doping (defined as a heavily-doped buried layer of 100 nm thickness) and deep trench isolation are used instead of conventional uniform doping and triple-well isolation.
机译:本文研究了将n型体驱动MOSFET扩展到90 nm节点的意义,以使该器件适合于在0.7 V(体CMOS端部预计的最小电源电压)下工作的模拟设计。观察结果表明,工艺缩放已使代表性的0.25μm和65 nm技术之间的g_(mb)/ g_m之比从0.38降低至0.12,并且传统的大容量驱动电路架构所期望的收益不再存在。纳米工艺,除非考虑某些修改。此外,将表明,大容量驱动MOSFET的主要缺点(即其固有增益低,截止频率低和布局面积要求低)可改善多达110%,50%和53%,如果分别使用增量掺杂(定义为厚度为100 nm的重掺杂掩埋层)和深沟槽隔离来代替常规的均匀掺杂和三阱隔离,则分别使用。

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  • 来源
    《Microelectronics reliability》 |2011年第4期|p.727-732|共6页
  • 作者单位

    Department of Electrical and Microelectronic Engineering, Rochester Institute of Technology, 79 Lomb Memorial Drive, Rochester, NY 14623, USA;

    Department of Electrical and Microelectronic Engineering, Rochester Institute of Technology, 79 Lomb Memorial Drive, Rochester, NY 14623, USA;

    Department of Electrical and Microelectronic Engineering, Rochester Institute of Technology, 79 Lomb Memorial Drive, Rochester, NY 14623, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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