Copper Wire Bonding

摘要

Reducing the need for gold, copper wire bonding will save us money, and eventually, the majority of wire bonds will be copper. The wire bonding industry has undergone major transitions before, such as to high ultrasonic frequency and to fine pitch wire bonding, followed by increased productivity and lower cost. Given the perceived and proven benefits of copper, it is not a question of whether but rather when the transition from gold will be complete. Wire bonding is the process of attaching microwires to integrated circuits. Wire bonds are the backbone interconnect of the microelectronics industry. Wire bonding is the most versatile and economical of all interconnect methods, despite being the oldest. The invention of a string to connect two points in space dates back a very long time and in the form of wire has been justifying ever increasing research efforts.