...
机译:在恶劣的热循环条件下提高了铜芯焊点的可靠性
School of Advanced Materials Engineering, Kookmin University, Jeongneung-gil 77, Seongbuk-gu, Seoul 136-702, Republic of Korea;
School of Advanced Materials Engineering, Kookmin University, Jeongneung-gil 77, Seongbuk-gu, Seoul 136-702, Republic of Korea;
School of Advanced Materials Engineering, Kookmin University, Jeongneung-gil 77, Seongbuk-gu, Seoul 136-702, Republic of Korea;
School of Advanced Materials Engineering, Kookmin University, Jeongneung-gil 77, Seongbuk-gu, Seoul 136-702, Republic of Korea;
Department of Chemical and Biological Engineering, Korea University, Anam-Dong, Seongbuk-gu, Seoul 136-701, Republic of Korea;
School of Advanced Materials Engineering, Kookmin University, Jeongneung-gil 77, Seongbuk-gu, Seoul 136-702, Republic of Korea;
机译:等温和温度循环条件下(Au,Ni)Sn $ _ {4} $演变对Sn-37Pb / ENIG焊点可靠性的影响
机译:大范围热循环条件下无铅焊点的可靠性
机译:汽车电子在恶劣振动条件下各种无铅焊料的联合可靠性
机译:SAC305无铅焊料在不同表面光洁度下的IMC生长机理及其对FCBGA封装在不同热老化和温度循环条件下焊点可靠性的影响
机译:结合热循环和振动载荷条件下的塑料球栅阵列(PBGA)焊点可靠性评估
机译:随机空隙的产生以及热冲击载荷对发光二极管倒装芯片焊点机械可靠性的影响
机译:PCB裂缝对单粒焊点无源微电子成分热循环可靠性的影响