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机译:机械可靠性试验下焊点的性能和断裂机理
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 70101, Taiwan, ROC;
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 70101, Taiwan, ROC;
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 70101, Taiwan, ROC;
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 70101, Taiwan, ROC;
Central Labs, Advanced Semiconductor Engineering, Inc., Kaohsiung 81170, Taiwan, ROC;
机译:焊点加速测试可靠性要求-一个不好的例子:指定焊点可靠性要求需要了解焊锡蠕变疲劳行为
机译:蠕变失效机制对功率半导体焊点热机械可靠性的影响
机译:低温下Sn-3.0Ag-0.5Cu焊料合金和接头的力学性能和断裂机理
机译:考虑无铅焊料塑性应变硬化的机械跌落测试下的板级焊点可靠性建模
机译:倒装芯片技术中焊点的可靠性:润湿,界面反应,机械剪切测试和电迁移等基础研究的方法。
机译:随机空隙的产生以及热冲击载荷对发光二极管倒装芯片焊点机械可靠性的影响
机译:环境试验下表面安装过程中SN-ZN焊点的热疲劳可靠性和机械疲劳可靠性