首页> 外文期刊>Microelectronics & Reliability >Optimized semi-sphere lens design for high power LED package
【24h】

Optimized semi-sphere lens design for high power LED package

机译:针对大功率LED封装的优化半球形透镜设计

获取原文
获取原文并翻译 | 示例

摘要

In recent years, high power light emitting diodes (LEDs) have played a very important role in many fields such as LED TV back light or white LED illumination. However, most of past LED package researches have focused on the directivity of LED units; the issue of the extraction efficiency usually has been investigated limited to the chip level, but no much attention paid at the package level. However, this should be a very important topic especially for today's high power LED output demand as we believe. In this work, utilizing a simulation tool, we show how the geometry of the package affects the efficiency of chip's output power. An optimized semi-sphere package is proposed, which can improve the efficiency by a factor of 23% compared with the traditional cylinder package. Even considering a needed directivity (e.g. 2θ_(1/2) = 24°) for some specific applications, the semi-sphere module can still have 17% output power more than that of a domed cylinder package. These results are very valuable and can be used as a reference guide for the design of the high power LED package.
机译:近年来,高功率发光二极管(LED)在许多领域(例如LED TV背光或白色LED照明)中发挥了非常重要的作用。但是,过去的大多数LED封装研究都集中在LED单元的方向性上。通常只在芯片级别研究提取效率的问题,但是在封装级别上并没有太多关注。但是,这应该是一个非常重要的主题,尤其是对于我们认为的当今大功率LED输出需求。在这项工作中,利用仿真工具,我们展示了封装的几何形状如何影响芯片输出功率的效率。提出了一种优化的半球形包装,与传统的圆筒包装相比,该包装可将效率提高23%。即使在某些特定应用中考虑了所需的方向性(例如2θ_(1/2)= 24°),半球形模块的输出功率仍可以比半球形圆柱体封装高17%。这些结果非常有价值,可以用作高功率LED封装设计的参考指南。

著录项

  • 来源
    《Microelectronics & Reliability》 |2012年第5期|p.894-899|共6页
  • 作者单位

    Institute of Precision Engineering, National Chung Hsing University, 250 Kuo Kuang Road, Taichung 402, Taiwan;

    Institute of Precision Engineering, National Chung Hsing University, 250 Kuo Kuang Road, Taichung 402, Taiwan;

    Institute of Precision Engineering, National Chung Hsing University, 250 Kuo Kuang Road, Taichung 402, Taiwan;

    Institute of Precision Engineering, National Chung Hsing University, 250 Kuo Kuang Road, Taichung 402, Taiwan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号