Impact of load pulse duration on power cycling lifetime of Al wire bonds

摘要

The elimination of solder interfaces in advanced power modules has increased the lifetime in active power cycling tests. It facilitates the investigation of Al wire bond reliability without the interference by solder fatigue. An extensive power cycling test program was conducted over the last 5 years to investigate the impact of test conditions on the component lifetime. The results serve as a basis to propose a new empirical lifetime model for advanced solder-free power modules. The test results and the empirical lifetime model will be presented with a special focus on the impact of the load pulse duration on the power cycling lifetime.