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机译:用于高温电子凸块中的Au-Ge共晶焊料在老化下的电性能
School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore;
School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore;
School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore;
School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore;
Institute of Microelectronics (IME), 11 Science Park Road, Singapore 117685, Singapore;
Institute of Microelectronics (IME), 11 Science Park Road, Singapore 117685, Singapore;
School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore;
机译:高温电子用Au-Ge和Au-Si共晶焊料合金的可靠性
机译:高温电子用Au-Ge和Au-Si共晶焊料合金的可靠性
机译:在高温焊料凸点的顶部施加共晶焊料
机译:高温电子学Au-Ge共晶钎料合金的电性能研究
机译:含铅和无铅焊料合金在电子包装中的金,钯,镍箔,引线框架和凸块下的薄膜金属上的润湿行为和界面反应。
机译:波峰焊接过程中焊锡温度对引脚通孔的影响:热流体结构相互作用分析
机译:Cu和Ni基材对共晶Au-Ge合金的润湿和焊接性能