Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules

摘要

A micro-sectioning approach for characterizing the quality or degradation state of interconnect interfaces in electronic components is described. The method is presented as a means of investigating the bonding quality of the Al wedge bonding process in IGBT modules. But in general it is applicable to any type of interface and may be used to assess the present quality of the interface. The micro-sectioning is based on mechanical polishing, chemical polishing, electro-etching, and various types of microscopy.