机译:硅通孔的双重周期性排列周围的应力分析估计
School of Mechanical Engineering. Purdue University, West Lafayette, IN 47907, United States;
School of Mechanical Engineering. Purdue University, West Lafayette, IN 47907, United States;
School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47907, United States;
机译:周期性电压脉冲施加的硅通孔瞬态电热机械响应的多物理场表征
机译:浮动硅衬底中硅通孔的分析电容模型
机译:考虑衬底效应和水平互连耦合的硅通孔串联阻抗的完整分析模型
机译:热硅通孔的解析传热模型
机译:对3D集成电路中通过硅通孔的热应力和可靠性的缩放和微观结构效应
机译:量身定制飞秒的1.5μm贝塞尔光束以制造高纵横比的硅通孔
机译:考虑衬底效应和耦合水平互连的硅通孔串联阻抗的完全分析模型