Reliability of micro-interconnects in 3D IC packages

摘要

As shrinking of the critical dimensions in integrated circuits becomes increasingly difficult, semiconductor industry resorts to other approaches to achieve the objective of building new devices that consume less power but have higher performance. To this end, the three dimensional integrated circuits (3D ICs) architecture is favored by many semiconductor companies. The stacking of chips in 3D ICs architecture allows for higher performance in much smaller packages. While substantial resources have been invested on resolving the design and processing issues, 3D integration still faces serious materials and reliability challenges.