机译:不同碳掺杂对InAlN / GaN HEMT性能和可靠性的影响
University of Padova, Department of Information Engineering via Gradenigo 6/b, 35131 Padova, Italy;
University of Padova, Department of Information Engineering via Gradenigo 6/b, 35131 Padova, Italy;
University of Padova, Department of Information Engineering via Gradenigo 6/b, 35131 Padova, Italy;
University of Padova, Department of Information Engineering via Gradenigo 6/b, 35131 Padova, Italy,Infineon Technologies, Austria AG, Siemenstrasse 2, 9500 Villach, Austria;
Ⅲ-Vlab., Route de Nozay, 91461 Marcoussis, France;
Ⅲ-Vlab., Route de Nozay, 91461 Marcoussis, France;
Ⅲ-Vlab., Route de Nozay, 91461 Marcoussis, France;
Ⅲ-Vlab., Route de Nozay, 91461 Marcoussis, France;
Ⅲ-Vlab., Route de Nozay, 91461 Marcoussis, France;
Ⅲ-Vlab., Route de Nozay, 91461 Marcoussis, France;
Infineon Technologies, Austria AG, Siemenstrasse 2, 9500 Villach, Austria;
University of Padova, Department of Information Engineering via Gradenigo 6/b, 35131 Padova, Italy;
InAlN/GaN; High electron mobility transistors; Carbon doping; Trapping; Drain current transients; Reliability;
机译:GaN封盖对通过CVD生长的AI_2O_3栅绝缘的InAlN / AlN / GaN MOS-HEMT性能的影响
机译:具有1nm厚InAlN势垒的常关GaN / InAlN / AlN / GaN HEMT的建议和性能分析
机译:新型超薄势垒n-GaN / InAlN / AlN / GaN HEMT结构的数值模拟:铟摩尔分数,掺杂和层厚度的影响
机译:增强模式n ++ GaN / InAlN / AlN / GaN HEMT中栅极材料工程的性能分析
机译:用于AlGaN / GaN和InAlN / GaN二极管以及在硅(111)衬底上生长的高迁移率晶体管的CMOS兼容氧化钌肖特基接触的研究。
机译:关于碳掺杂GaN中供体/受体补偿比的建模在横向GaN功率Hemts中的单一再现击穿电压和电流塌陷
机译:适用于坚固型HF接收器的InAlN / GaN HEMT技术:HF和LF噪声性能概述
机译:采用双栅极结构的GaN-ON-siC HEmT的性能和射频可靠性