首页> 外文期刊>Microelectronics & Reliability >Degradation analysis and current collapse imaging of AlGaN/GaN HEMTs by measurement of electric field-induced optical second-harmonic generation
【24h】

Degradation analysis and current collapse imaging of AlGaN/GaN HEMTs by measurement of electric field-induced optical second-harmonic generation

机译:通过测量电场诱导的光二次谐波产生,对AlGaN / GaN HEMT进行降解分析和电流崩塌成像

获取原文
获取原文并翻译 | 示例
获取外文期刊封面目录资料

摘要

On the basis of electric field-induced optical second-harmonic generation (EFISHG) measurements, the degradation of AlGaN/GaN high electron mobility transistor (HEMT) devices was analyzed and the current collapse phenomenon was imaged. Strong second-harmonic (SH) signals were observed at the gate edge at the site of a small defect during the application of a high drain stress voltage (300 V), thus indicating that this technique can identify degradation of HEMTs. The EFISHG technique also generated images of the trapped carriers that lead to current collapse in these devices during the on-state. Immediately following the completion of drain-stress voltage application in the off-state (that is, 1 μs), SH signals were observed at the gate edge on the drain electrode. This signal location is in good agreement with the well-known virtual gate model of current collapse. The EFISHG measurement technique is therefore capable of detecting pre-breakdown phenomena and producing images of current collapse in AlGaN/GaN HEMT devices.
机译:在测量电场感应光二次谐波(EFISHG)的基础上,分析了AlGaN / GaN高电子迁移率晶体管(HEMT)器件的退化情况,并对电流崩塌现象进行了成像。在施加高漏极应力电压(300 V)期间,在小缺陷部位的栅极边缘处观察到强的二次谐波(SH)信号,因此表明该技术可以识别HEMT的降解。 EFISHG技术还生成了捕获载流子的图像,这些载流子在导通状态下导致这些器件中的电流崩溃。在关闭状态下(即1μs)完成漏极应力施加后,立即在漏极的栅极边缘观察到SH信号。该信号位置与电流崩溃的众所周知的虚拟门模型非常吻合。因此,EFISHG测量技术能够检测预击穿现象并生成AlGaN / GaN HEMT器件中电流崩塌的图像。

著录项

  • 来源
    《Microelectronics & Reliability》 |2014年第10期|2227-2231|共5页
  • 作者单位

    Toyota Central R&D Laboratories Inc., Nagakute, Aichi 480- 1192, Japan;

    Department of Physical Electronics, Tokyo Institute of Technology, Meguro, Tokyo 152-8552, Japan;

    Toyota Central R&D Laboratories Inc., Nagakute, Aichi 480- 1192, Japan;

    Toyota Central R&D Laboratories Inc., Nagakute, Aichi 480- 1192, Japan;

    Toyota Central R&D Laboratories Inc., Nagakute, Aichi 480- 1192, Japan;

    Department of Physical Electronics, Tokyo Institute of Technology, Meguro, Tokyo 152-8552, Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    GaN; Reliability; Degradation; Current collapse; SHG;

    机译:氮化镓;可靠性;降解;当前崩溃;SHG;

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号