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Precise nanofabrication with multiple ion beams for advanced circuit edit

机译:具有多个离子束的精密纳米加工,可用于高级电路

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Gallium focused ion beam (Ga-FIB) systems have been used historically in the semiconductor industry for circuit edit. Significant efforts have been invested to improve the performance of Ga-FIB. However, as the dimensions of integrated circuits continue to shrink, Ga-FIB induced processes are being driven to their physical limits. A helium ion beam offers high spatial resolution imaging as well as precise ion machining and sub-10 nm nanofabrication capabilities because the probe size can be brought to as small as 0.25 nm. However, it is limited by its relatively low material removal rate. Recently, the new Zeiss Orion-NanoFab microscope provides multiple ion beams (He, Ne and Ga as an option) into one platform and promotes the further studies of He and Ne induced deposition and etching processes to compare with a Ga ion beam. Because of the mass difference between He, Ne and Ga ions, the interactions of ions with sample surface and precursor molecules result in different sputtering rates, implantation and deposition yields. This presentation gives an overview of our current studies using this new platform to deposit or mill nano-structures for circuit edit.
机译:镓聚焦离子束(Ga-FIB)系统历史上已在半导体行业中用于电路编辑。为了改善Ga-FIB的性能,已经投入了大量的精力。但是,随着集成电路尺寸的不断缩小,Ga-FIB诱导的工艺正被驱动到其物理极限。氦离子束可提供高空间分辨率的成像以及精确的离子加工和10纳米以下的纳米加工能力,因为探头尺寸可小至0.25 nm。但是,它受到相对较低的材料去除率的限制。最近,新型的蔡司Orion-NanoFab显微镜将多个离子束(He,Ne和Ga可选)提供到一个平台中,并促进了He和Ne诱导的沉积和蚀刻工艺的进一步研究,以与Ga离子束进行比较。由于He,Ne和Ga离子的质量差异,离子与样品表面和前驱物分子的相互作用导致溅射速率,注入和沉积产量不同。本演讲概述了我们目前使用该新平台沉积或研磨纳米结构以进行电路编辑的研究。

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