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An investigation on capacitance-trigger ESD protection devices for high voltage integrated circuits

机译:高压集成电路电容触发式ESD保护器件的研究

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摘要

A novel cascaded complementary dual-directional silicon controlled rectifier (CCDSCR) structure has been proposed and implemented in a 0.5 μm 20 V Bipolar/CMOS/DMOS process as an ESD (electrostatic discharge) protection device. The ESD characteristics of the capacitance-trigger CCDSCR has been investigated by transmission line pulse (TLP) testing. Compared with the substrate-trigger insulated gate bipolar transistor with the enhanced substrate parasitic capacitance, the gate-driven trigger insulated gate bipolar transistor with the gate coupling capacitance and the normal dual-directional silicon controlled rectifier, the CCDSCR has the highest holding voltage of about 25.4 V and the best current conduction uniformity. In addition, it has the best figure of merit (FOM) with the value of about 0.64 mA/μm~2. The good current conduction uniformity in CCDSCR due to the enhanced substrate parasitic capacitance-trigger effect is finally confirmed by Sentaurus simulations.
机译:已经提出了一种新颖的级联互补双向可控硅(CCDSCR)结构,并以0.5μm20 V双极/ CMOS / DMOS工艺实现了这种结构,作为ESD(静电放电)保护器件。通过传输线脉冲(TLP)测试已经研究了电容触发CCDSCR的ESD特性。与具有增强的衬底寄生电容的衬底触发绝缘栅双极晶体管,具有栅极耦合电容的栅驱动触发绝缘栅双极晶体管和普通的双向可控硅整流器相比,CCDSCR的保持电压最高25.4 V和最佳电流传导均匀性。此外,它具有最佳品质因数(FOM),约为0.64 mA /μm〜2。 Sentaurus模拟最终证实了由于增强的衬底寄生电容触发效应而导致的CCDSCR中良好的电流传导均匀性。

著录项

  • 来源
    《Microelectronics & Reliability》 |2014年第7期|1169-1172|共4页
  • 作者单位

    Key Laboratory of Advanced Process Control for Light Industry (Ministry of Education), Department of Electronic Engineering, Jiangnan University, Wuxi 214122, China ,ESD Laboratory, Department of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China;

    Key Laboratory of Advanced Process Control for Light Industry (Ministry of Education), Department of Electronic Engineering, Jiangnan University, Wuxi 214122, China;

    Key Laboratory of Advanced Process Control for Light Industry (Ministry of Education), Department of Electronic Engineering, Jiangnan University, Wuxi 214122, China;

    ESD Laboratory, Department of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China;

    ESD Laboratory, Department of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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