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机译:Cu ABL功率凸块的倒装芯片键合结构的表征
Graduate School of NID Fusion Technology, Seoul National University of Science and Technology, 232 Gongreung-rho, Nowon-gu, Seoul 139-743, Republic of Korea;
Department of Mechanical System Design Engineering, Seoul National University of Science and Technology, 172 Gongreung 2dong, Nowon-gu, Seoul 139-743, Republic of Korea;
Graduate School of NID Fusion Technology, Seoul National University of Science and Technology, 232 Gongreung-rho, Nowon-gu, Seoul 139-743, Republic of Korea;
ABL; Power bumps; Flip chip bonding; Power distribution; Thermal reliability;
机译:金钉凸点与Sn-0.7Cu焊料用于倒装芯片功率器件封装的混合互连的微结构和可靠性
机译:大气压等离子处理对倒装金凸块与超声作用下结合的含铜硅晶片衬底之间结合强度的影响
机译:凸块冶金条件下含Ti / Ni(V)/ Cu的Sn-37Pb和Sn-3Ag-1.5Cu / Sn-3Ag-0.5Cu复合倒装芯片凸块的电迁移
机译:在Au / Ni / Cu / Cu或Cu金属的基材垫上粘合在96.5sn-3ag-0.5cu倒装芯片焊盘上的电迁移
机译:研究无铅倒装芯片焊料凸块中的电迁移行为。
机译:使用超声波传感器检查倒装芯片焊锡凸点的缺陷
机译:凸点金属化和SnPb倒装芯片凸点下镍/铜之间的锡基铜扩散和金属间化合物形成